Wafer Bonder
Fully Automatic Wafer Temporary Bonder
Peculiarity
4"-8"/8"-12"wafer application
Automatic support wafer & device wafer bonding
Thinner wafer capability
Opitonal post measuring bonded wafer
Vacuum thermal press bonding
Compatible wafer cassette / wafer box
PC based control with Windows OS
Intelligent wafer mapping in cassette
SECS/GEM or simple link capability
Automatic support wafer & device wafer aligning